The invention provides Tegal with a unique new PVD source technology for advanced applications in chip manufacturing. Direct benefits of this invention include the capability of providing highly directional deposition of metal atoms and ions, and the easy utilization of magnetic target materials such as Nickel.
Conventional PVD sources are limited by their reliance on strong magnetic fields. This makes sputtering of magnetic materials problematic and inefficient. Nickel films will be needed for contact metal silicide formation at the 45-nanometer "node" of chip manufacturing, and in many of the "lead-free" final packaging schemes. The ability to sputter Nickel and other magnetic materials efficiently also has many benefits for MRAM, thin film heads and a wide variety of MEMS applications.