In 2022, Everspin Technologies announced the EMxxLX xSPI serial interface series, the industry’s first xSPI serial interface persistent memory. Later in 2022 the EMxxLX devices started to ship commercially.
The EMxxLX family offered an octal interface with 400MB/s bandwidth, compatibility with the xSPI standard and 1000X faster write times compared to NOR flash. The EMxxLX devices were available with density from 8Mb to 64Mb, and Everspin now announced that it is expanding its product offering, adding a 4Mb option and also new, smaller packaging for the 4-to-16-megabit products.
The new 5mm x 6mm DFN package is an area savings of 37% over the existing offering. In addition to the new capacity and smaller packaging, Everspin delivers an extended temperature range in the EMxxLX products of -40⁰C to 105⁰C. The new 4Mb smaller DFN package chips are now sampling, with production planned for the first quarter of 2024.
Disclosure: the author of this post holds shares at Everspin
