November 2024

Researchers from UNIST design a high-efficiency graphene-based MRAM device

Researchers from Korea's Ulsan National Institute of Science & Technology (UNIST) have designed a new MRAM structure, based on graphene, that offers higher efficiency (and lower heat generation) compared to existing MRAM solutions.

The design of the MRAM device is based on a graphene layer sandwiched between a magnetic insulator (yttrium iron garnet) and a ferroelectric material (PVDF-TrFE). Upon application of a voltage pulse, the current flow through the graphene is altered, enabling the storage of binary data based on this current direction.

Read the full story Posted: Nov 28,2024

Hprobe and NY CREATES to co-develop next-generation MRAM testing capabilities

Hprobe, a developer of testing equipment for magnetic devices, announced a strategic collaboration with NY CREATES, a lab-to-fab bridge for advanced electronics, to advance testing capabilities for next-generation semiconductor memory technologies. This joint development project will focus on the co-development of advanced testing equipment at the 300mm wafer scale.

Hprobe IBEX WAT H3DM Light photo

NY CREATES and Hprobe will work together to support new testing solutions for MRAM, RRAM and selector devices. The joint project will focus on initial testing of MRAM and RRAM wafers from NY CREATES using Hprobe’s equipment, including the full-scale implementation of Hprobe’s IBEX wafer-level magnetic tester. Development of breakthrough testing procedures and algorithms for MRAM, RRAM, and selector devices, will also seek to advance the state-of-the-art in semiconductor memory testing.

Read the full story Posted: Nov 13,2024 - 1 comment

Avalanche partners with Trusted Semiconductors to develop DDR3/4 memory products hardened to strategic levels

pMTJ STT-MRAM developer Avalanche Technology announced a new partnership with Trusted Semiconductor Solutions (TSS) to provide valued DDR3/4 non-volatile memory products hardened to strategic levels for the aerospace & defense community. 

Avalanche Technology MRAM chips render

Building on prior collaborations between Avalanche and TSS, this new product family will address the critical need for radiation resilient, high reliability execution memory with instant-on capability for Strategic radiation environments. Leveraging Avalanche's broadly adopted modular Gen 3 MRAM product architecture TSS will add specialized survivability features uniquely required for this application and provide the storefront for this tailored solution.

Read the full story Posted: Nov 13,2024