June 2017

GlobalFoundries has plans to deploy Everspin's perpendicular (pMTJ) STT-MRAM as an embedded 22nm memory - as part of GF's 22FDX platform. GlobalFoundries has released a technical paper that details the eMRAM ability to retain data at high temperatures.

The eMRAM can retain data through solder reflow at 260 degrees Celsius, and for more than 10 years at 125 degrees Celsius, plus read/write with outstanding endurance at 125 degrees Celsius. GlobalFoundries says that this will enable eMRAM to be used for general purpose MCUs and automotive SOCs.

According to reports, Taiwan Semiconductor Manufacturing Company (TSMC) is aiming to start producing embedded MRAM chips in 2018 using a 22 nm process. This will be initial "risk production" to gauge market reception.

TSMC also aims to start embedded RRAM chip production in 2019.