Recent MRAM News - Page 2

Everspin signs a $9.25 million contract with Frontgrade for strategic radiation hardened MRAM technology

Everspin Technologies announced a new strategic contract with Frontgrade Technologies. Everspin will provide  its PERSYST MRAM technology, logic design, and back-end-of-line manufacturing services, to advance the development and demonstration of a Strategic Radiation Hardened (SRH) high-reliability eMRAM macro for use in future products by Frontgrade.

Everspin Technologies chip photo

This initiative supports both current and future Department of Defense (DoD) strategic and commercial space system requirements. It will be manufactured using Skywater RH90 CMOS in Bloomington, Minnesota and Everspin’s back-end-of-line MRAM process in Chandler, Arizona. The contarct has several phases over multiple years - with the first phase valued at $1.25 million, and all phases at $9.25 million. Upon successful performance of this phase, and at the discretion of the U.S. government, the contract allows for award of future optional phases.

Read the full story Posted: Aug 15,2024

Everspin reported its financial results for Q2 2024

Everspin Technologies reported its financial results for Q2 2022. Revenues were $10.6 million (down from $15.7 million in Q2 2023), and net loss was $0.2 million (down from a new profit of $5.4 million in Q2 2023). The company is cash flow positive, generated $1.7 million in the quarter, and ended it with $36.8 million in cash and equivalents.

Everspin 1Gb STT-MRAM chip photo

During the quarter, the company experienced weakness in toggle MRAM sales, partly due to inventory consumption and partly due to unfavorable currency exchange. Looking ahead, Everspin sees positive signs of inventory consumption, and expects a modest ramp in toggle MRAM sales in the rest of 2024. Everspin said it has strong traction with its new PERSYST family of MRAM products, and expects to start delivering the first products to its customers towards the end of 2024 or early 2025.

Read the full story Posted: Aug 01,2024

Avalanche launches an enhanced discrete space-grade MRAM product family

pMTJ STT-MRAM developer Avalanche Technology launched a new enhanced discrete product family called "Space Grade-E", targeting the aerospace & defense community. The new Space Grade-E MRAM is based on Avalancehe's Gen 3 high density, high reliability MRAM technology, and it allows pin compatible scalability to MEO, GEO, and beyond.

 

Avalanche Technology MRAM chips render

The Space Grade-E family is now sampling, and is offered in both Parallel and Dual QSPI interface types. Compared to the company's previous generation space-grade MRAM, this new generation includes a boost in radiation tolerance specs and burn in hours for improved reliability. The new memory is maintains pin-compatible migration from Avalanche's previous generation space-grade MRAM. 

Read the full story Posted: Jul 30,2024

MRAM-based memory architecture could accelerate AI by a factor of 1000

Researchers from the University of Minnesota Twin Cities developed a new AI hardware accelerator, based on MRAM memory, that can accelerate AI computation by a factor of 1,000. 

The so-calledd Computational Random-Access Memory device, or CRAM, is a machine learning inference accelerator, that is not just 1,000 faster, it also exhibits energy saves of 1,700 to 2,500 times compared to traditional methods. 

Read the full story Posted: Jul 29,2024

Everspin and QuickLogic sign a strategic agreement to bring MRAM technology to radiation hardened FPGAs

In 2022,  Everspin Technologies signed a contract to provide MRAM technology, design, and back end of line manufacturing services to QuickLogic Corporation for a project funded by the US Department of Defense. 

Everspin Technologies chip photo

Today Everspin announced a new strategic contract with QuickLogic. Everspin will provide its innovative AgILYST MRAM technology, logic design, and back end of line manufacturing services to advance the development and demonstration of a Strategic Radiation Hardened (SRH) high-reliability Field Programmable Gate Array (FPGA) technology. 

Read the full story Posted: Jul 25,2024

CEA-Leti and NY CREATES to co-develop STT-MRAM and SOT-MRAM devices on 300 mm wafers

The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) and CEA-Leti announced a two-year strategic R&D partnership, that will initially focus on the research and co-development of MRAM devices.

NY CREATES and CEA-Leti will develop and produce both STT-MRAM and SOT-MRAM devices on 300 mm substrates. CEA-Leti will contribute its expertise in magnetics, spintronics, and the testing of related devices, and NY CREATES will provide the facilities, process integration expertise, and materials process development to run the 300mm silicon hardware.

Read the full story Posted: Jun 27,2024

Alif Semiconductor launch a new AI/ML microcontroller with optional MRAM memory

Alif Semiconductor announced a new microcontroller in its Ensemble family, the E1C, that offers 46 giga-operations per second (GOPS) of minimum-precision compute for on-device machine learning and artificial intelligence workloads.

The Alif E1C offers several memory options, depending on the model, ranging from 256Kb of SRAM in the entry-level option, up to 1.9Mb of MRAM and 2Mb of SRAM in the high-end option.

Read the full story Posted: Jun 19,2024

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By advertising on MRAM-Info, you can tap into a wide audience of professionals, researchers, and enthusiasts who are actively seeking information and solutions related to MRAM technology. Here are some compelling reasons why advertising on MRAM-Info is a smart move:

Targeted Audience

MRAM-Info attracts a highly targeted audience of individuals and organizations interested in MRAM technology. This includes engineers, scientists, researchers, product developers, and decision-makers from various industries. By advertising on MRAM-Info, you can ensure that your message reaches the right people who are actively interested in your products or services.

Read the full story Posted: Jun 10,2024

Samsung on track to start 14 nm eMRAM production by the end of 2024, 8 nm by 2026 and 5 nm by 2027

In 2019, Samsung Electronics announced that it has started to mass produce its first embedded MRAM devices, made using the company's 28 nm FD-SOI process. In 2021, Samsung announced it is working to scale down to 14 nm processes.

The company now says that it has finalized the development of its 14 nm eMRAM process, and will be read to mass produce it by the end of 2024. The company says that the 14 nm process achieve a 33% area scaling compared to its 28 nm process, and it also enables a 2.6x faster read cycle time. Samsung says that its eMRAM enables the smallest size 16MB memory die.

Read the full story Posted: Jun 01,2024

Numem and IC’ALPS co-develop a custom MRAM-powered AI accelerator

High-performance STT-MRAM developer Numem announced that in collaboration with ASIC/SoC designer IC’ALPS it has developed an integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator.

The two companies co-developed the SoC in an advanced technology node, taking advance of the high-performance and low power consumption of Numem's memory technology. The company also details that the physical implementation of this integrated circuit was made in a secure space (isolated location, network, and servers, and encrypted exchanges) to meet with the stringent protection of sensitive data required by this program. Numem and IC’Alps intend to extend their partnership to serve new SoC projects for customers.

Read the full story Posted: May 31,2024